PCB Wet Process Brown Oxide Treatment: Function and Working Principle

The PCB wet process brown oxide machine plays a vital role in the PCB wet process, and its core functions are mainly reflected in four aspects:

1. Enhance Interlayer Bonding Strength: The brown oxide machine generates a uniform and micro-rough brown oxide film on the surface of the inner copper foil. This special rough structure forms a "mechanical interlock effect" at the microscopic level, which can make the resin of the prepreg fully penetrate into the gaps of the oxide film, greatly improving the peel strength between the copper layer and the prepreg, and completely eliminating the risk of interlayer delamination.

2. Optimize Interface Performance: The brown oxide film formed by the brown oxide machine is rich in active functional groups. These groups can form stable chemical bonds with the resin molecules of the prepreg during the lamination process, while effectively improving the fluidity of the resin, reducing the generation of interface voids, and further improving the overall lamination quality of the PCB.

3. Protect Copper Surface and Improve Corrosion Resistance: The dense brown oxide film can provide short-term anti-oxidation protection for the copper surface, preventing the copper surface from being oxidized before lamination. At the same time, it can resist the erosion of acidic chemicals in subsequent PCB wet processes, reduce the occurrence of line

4. undercutting, and ensure the dimensional accuracy of fine circuits.

5. Adapt to High-End PCB Production Needs: With the rapid development of 5G communications, automotive electronics and other industries, the requirements for PCB stability and precision are getting higher and higher. The brown oxide machine can perfectly meet the strict requirements of HDI boards, high-frequency high-speed boards for interlayer stability and heat resistance, and is an essential equipment for mass production of high-end PCBs.