Views: 0 Author: Site Editor Publish Time: 2025-06-13 Origin: Site
AI/Data Centers: Global demand for AI server PCBs surges, with HDI boards and high-layer-count PCBs (20+ layers) becoming mainstream. The value of PCBs per AI server exceeds $5,000. Chinese companies like Shennan Circuits and WUS Printed Circuit dominate the high-end market.
Automotive Electronics: Rising EV penetration drives automotive PCB demand to 20% of the market, with a market size exceeding $30 billion. High-thermal-conductivity and high-reliability materials (e.g., aluminum substrates) are in high demand.
Consumer Electronics: Foldable phones and smart wearables boost FPC (flexible PCB) growth, with its market share rising to 17.5%. Chinese manufacturers like Dongshan Precision accelerate their布局 (expansion).
High-Frequency/High-Speed Materials: Low-dielectric-loss resins and hydrocarbon-based substrates drive 5G mmWave applications, with domestic substitution accelerating.
Smart Manufacturing: Leading companies (e.g., AT&S, Unimicron) achieve full-process digitization via AI+IoT, improving production efficiency by 30%.
Green Production: EU RoHS 3.0 standards drive the adoption of lead-free laminates, with wastewater recycling coverage exceeding 70%.
China Dominates: China accounts for over 50% of global PCB output value. Companies like Shennan Circuits and Zhen Ding Technology rank among the global top 10, accelerating breakthroughs in high-end capacities (e.g., FC-BGA substrates).
Southeast Asia Shift: Thailand and Vietnam form emerging industrial clusters. Chinese companies (e.g., Dongshan Precision, WUS Printed Circuit) accelerate overseas布局 (expansion) to avoid tariffs and reduce costs.
Head-to-Head Monopoly: Top 10 firms hold over 30% market share, with AI server PCB margins reaching 35–40%. SMEs focus on niche markets.
High-End Focus: AI, 6G, and autonomous driving drive PCBs toward high-frequency/high-speed, high-density, and high-thermal designs.
Regionalization: China leads high-end manufacturing, Southeast Asia absorbs mid-to-low-end capacities, and Europe/US focus on R&D and standard-setting.
Green Transition: ESG requirements rise, prompting firms to accelerate low-carbonization (e.g., solar power, recycling processes) to meet global standards.
Summary: The global PCB industry is characterized by "high-end demand, rapid technological iteration, and deepened regional division of labor." China sustains its leadership through scale and technological advantages, while Southeast Asia accelerates capacity transfers. Future competition will center on high-end materials and smart manufacturing.
