Multi-layer Board Dual-Pin Mounting Machine: The "Efficiency Engine" Driving Automation Upgrades in PCB Manufacturing
Against the backdrop of rapid global adoption of 5G, artificial intelligence, and IoT technologies, demand for high-density multi-layer printed circuit boards (PCBs) continues to surge. As a critical process in multi-layer board production, the precision and efficiency of pin mounting directly impact product yield and cost. [Brand Name] has recently launched a new-generation multi-layer board dual-pin mounting machine, offering fully automated, high-precision, and high-efficiency solutions to empower PCB manufacturers with intelligent upgrades and help the industry overcome capacity bottlenecks.
Technological Innovation: 6-Second Stacked Board Mounting with ±0.05mm Precision
The equipment utilizes a Mitsubishi (Japan) PLC control system combined with vibratory feeder technology for continuous, stable pin delivery and precise positioning. Its core advantages include:
Ultra-Fast Cycle Time: Single stacked board mounting takes just 6 seconds, supporting PCB sizes ranging from a maximum of 800×680mm to a minimum of 250×250mm, covering mainstream multi-layer board specifications.
Millimeter-Level Precision: Driven by high-precision servo motors, pin placement accuracy is controlled within ±0.05mm, meeting stringent requirements for advanced HDI boards, high-frequency boards, and other demanding applications.
Reliable Performance: Modular design and a low-failure-rate PLC system ensure 24/7 continuous operation, minimizing downtime and maintenance costs.
Industry Impact: Accelerating PCB Manufacturing Toward "Smart" Transformation
Cost Reduction: Automation reduces manual intervention, lowering labor costs and human errors while improving yield by 15%+.
Efficiency Gains: Rapid tooling changeovers support flexible production of multi-specification products, helping enterprises shorten delivery cycles and capture high-end market opportunities.