In-depth Analysis of the Current Market Status of the US PCB Industry in 2025

I. Market Size and Growth Trends

In 2025, the global PCB market is projected to reach 96.8billion,withacompoundannualgrowthrate(CAGR)of5.860 billion, accounting for over 50% of the global share. The US market, as a pivotal player in the global PCB industry, aligns closely with global technological advancements. Its growth is primarily driven by three major sectors:

1. Explosion in AI Server Demand: The value of PCBs per AI server reaches as high as 5,000,withtheglobalmarketsizeexceeding12 billion. North American data center construction directly fuels the demand for high-end PCBs.

2. Penetration of New Energy Vehicles: The demand for automotive PCBs is projected to rise from 12% in 2020 to 20% in 2025, with a market size exceeding $30 billion. The localization production of automakers like Tesla drives the demand for automotive electronics PCBs in the US.

3. Expansion of 5G Infrastructure: With over 5 million 5G base stations globally, the demand for high-frequency and high-speed PCBs grows by 25%, with US 5G network deployment serving as a key growth driver.

   
   

II. Polarization of Supply and Demand Patterns

1. Tight Supply in High-End Sectors

• Technical Bottlenecks: High-end products such as IC substrates and high-frequency high-speed boards face a global supply gap of approximately 8%. US domestic enterprises still rely on imports in areas like package substrates and millimeter-wave radar boards, with foreign monopolies exceeding 75%.

• Insufficient Domestic Capacity: Despite the US promoting "reshoring," the expansion of high-end PCB capacity lags, leading to reliance on Asian supply chains for critical areas like AI servers and 5G equipment.

2. Overcapacity in Low-End Sectors

• Intense Price Wars: Low-end PCB products below 8 layers face fierce market competition due to low technical barriers. Chinese enterprises, leveraging cost advantages, occupy over 60% of the global market share, posing survival pressures on US small and medium-sized manufacturers.

• Accelerated Capacity Transfer: To evade tariffs, Chinese PCB enterprises are rapidly establishing factories in Southeast Asia (e.g., Thailand, Vietnam), further shrinking US domestic low-end capacity.

III. Competitive Landscape and Technological Evolution

1. Global Competitive Landscape

• Monopoly of High-End by Top Tier: Japanese enterprises like Shinko and Korean enterprises like Samsung Electro-Mechanics dominate in HDI and package substrates. US domestic enterprises such as TTM Technologies and Sanmina maintain their lead in high-end markets like aerospace and medical electronics.

• Breakthroughs by Chinese Enterprises: Through technological advancements in AI server PCBs, Chinese enterprises like Shennan Circuits and WUS Printed Circuit have secured over 30% global market share with gross margins of 35%-40%, yet still face pressure from international giants in high-end sectors.

2. Technological Development Trends

• High-Frequency and High-Speed Materials: 5G communications drive the application of high-frequency materials like PTFE and ceramic substrates. Domestic alternatives to Rogers RO4000 series high-frequency boards are accelerating, with costs reduced by 30%.

• HDI Technology Iteration: Supporting complex designs above 18 layers, with delivery cycles shortened to 72 hours. Microvia technology matures, with layer counts exceeding 20 layers.

• Green Manufacturing: Solar PCB factories account for over 20% of the market, with per-ton carbon emissions reduced by 30%. Wastewater treatment technologies become standard.

• Intelligent Manufacturing: AI-assisted design, digital twin technologies, and automated production lines (e.g., robotic placement, online quality inspection) enhance production efficiency.