PCB Wet Process Machine Utilization Flow

The machine utilization flow for the PCB wet process typically involves multiple stages, each requiring specific machinery and equipment. Below is an overview of a typical PCB wet process machine utilization flow:

Pre-treatment

1. Deburring

• Machine: Horizontal brush wheel grinding machine, using nylon brushes, non-woven fabric, or ceramic brush wheels.

• Flow: Remove copper shavings left on the hole edges after drilling through brushing.

2. Desmearing

• Machine: Desmearing equipment, possibly using concentrated sulfuric acid, dichromic acid, plasma, or potassium permanganate methods.

• Flow: Remove the resin smear generated during drilling, roughen the hole walls, and facilitate the subsequent adhesion of chemical copper.

Chemical Copper Deposition (Copper Plating)

1. Brush Cleaning

• Machine: Brush cleaning machine.

• Flow: Clean the board surface to remove dirt and grease.

2. Chemical Copper Plating

• Machine: Automatic copper plating line.

• Flow: Deposit a thin layer of copper on the hole walls and board surface through chemical reactions, providing a conductive layer for subsequent electroplating.

Electroplating

1. Panel Plating

• Machine: Thickening electroplating line, thin panel electroplating line, etc.

• Flow: Electroplate a layer of copper on the entire board surface to increase conductivity and thickness.

2. Pattern Plating

• Machine: Pattern electroplating line.

• Flow: Electroplate on the already prepared pattern to increase its conductivity and protect non-pattern areas.

Etching

1. Acid Etching

• Machine: Acid etching line.

• Flow: Use an acidic solution to etch away unwanted copper layers, leaving the pattern areas.

2. Alkaline Etching

• Machine: Alkaline etching line.

• Flow: Use an alkaline solution for etching, suitable for processing certain specific materials.

Post-treatment

1. Stripping

• Machine: Stripping equipment.

• Flow: Remove the protective film used during electroplating and etching.

2. Cleaning

• Machine: Cleaning equipment, such as single-panel cleaning machines.

• Flow: Thoroughly clean the board surface to remove residual chemicals and impurities.

3. Drying

• Machine: Drying equipment.

• Flow: Dry the cleaned PCB board to remove moisture and prepare for subsequent processes.

Automation and Quality Control

1. Loading Robots

• Machine: Loading robots.

• Flow: Use robots at the loading and unloading ends of the wet process to achieve automated production, improving efficiency and quality.

2. Chemical Analysis

• Machine: Chemical analyzer.

• Flow: Conduct chemical analysis on the used chemicals to ensure their composition and concentration meet requirements.

3. Process Monitoring

• Machine: Process monitoring equipment.

• Flow: Continuously monitor the entire wet process to ensure that each stage operates within specified parameters.

• PCB (Printed Circuit Board)

• Wet Process

• Machine Utilization Flow

• Pre-treatment

• Chemical Copper Deposition

• Electroplating

• Etching

• Post-treatment

• Automation