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KX-LAV
High Clamping Force Range: Customizable from 40 to 20,000 kN (60 to 3,000 Tons) to cover all PCB panel sizes.
Airtight Deep Vacuum Chamber: Rapidly evacuates to < 10 mbar (< 7.5 mm Hg) in under 3 minutes for absolute void-free lamination
Uncompromising Platen Accuracy: Flatness and Parallelism are strictly held at ≤ 0.05 mm (0.002") conforming to German DIN-ISO 1101 standards.
Integrated Hot & Cold Platforms: Seamlessly transitions between heating and cooling on a single platform (up to 300°C / high-temp customization up to 450°C) with closed-loop thermal oil, eliminating secondary thermal shock.
Industry 4.0 & MES Connectivity: Built-in Windows 10 OS, PLC control, and visual interface with full Remote Diagnostics support.
Machine Technical Parameters：
| Technical Parameter | Model: LAV125 | Model: LAV250 | Model: LAV400 | Model: LAV500 | Model: LAV720 | Model: LAV1400 | Model: LAV2000 |
|---|---|---|---|---|---|---|---|
| Number of Openings | 2 / 4 / 6 / 8 / 10 | 6 / 8 / 10 / 12 | 8 / 10 / 12 | 8 / 10 / 12 | 8 / 10 / 12 | 10 / 12 | 10 / 12 |
| Pressure Range | 40 - 1250 kN (8,800 - 275,000 lbs) | 90 - 2500 kN (19,800 - 550,000 lbs) | 200 - 4000 kN (44,000 - 880,000 lbs) | 200 - 5000 kN (44,000 - 1,100,000 lbs) | 280 - 7200 kN (61,600 - 1,584,000 lbs) | 800 - 14000 kN (176,000 - 3,080,000 lbs) | 800 - 20000 kN (176,000 - 4,400,000 lbs) |
| Platen Size (Press Surface) | 750 x 600 mm (29.5” x 23.6”) | 750 x 1150 mm (29.5” x 45.3”) | 850 x 1350 mm (33.5” x 53.1”) | 1200 x 1350 mm (47.2” x 53.1”) | 1350 x 1550 mm (53.1” x 61.0”) | 1200 x 1350 mm (47.2” x 53.1”) | 1350 x 1600 mm (53.1” x 63.0”) |
| Useful Surface Area | 700 x 550 mm (27.6” x 21.7”) | 700 x 1100 mm (27.6” x 43.3”) | 800 x 1300 mm (31.5” x 51.2”) | 1150 x 1300 mm (45.3” x 51.2”) | 1300 x 1500 mm (51.2” x 59.1”) | 1150 x 1300 mm (45.3” x 51.2”) | 1300 x 1550 mm (51.2” x 61.0”) |
| Specific Pressure on Useful Area | 268 N/cm² (388 psi) | 325 N/cm² (471 psi) | 879 N/cm² (1275 psi) | 334 N/cm² (485 psi) | 369 N/cm² (536 psi) | 702 N/cm² (1018 psi) | 993 N/cm² (1440 psi) |
| Daylight Distance (Clear Opening) | 75 / 100 mm (2.95” / 3.94”) | 75 / 100 mm (2.95” / 3.94”) | 100 mm (3.94”) | 100 mm (3.94”) | 100 mm (3.94”) | 100 / 120 mm (3.94” / 4.72”) | 115 mm (4.53”) |
| Vacuum Level | < 10 mbar (< 7.5 mm Hg) | < 10 mbar (< 7.5 mm Hg) | < 10 mbar (< 7.5 mm Hg) | < 10 mbar (< 7.5 mm Hg) | < 10 mbar (< 7.5 mm Hg) | < 10 mbar (< 7.5 mm Hg) | < 10 mbar (< 7.5 mm Hg) |
| Max. Operating Temperature | 250°C / 300°C (482°F / 572°F) | 250°C / 300°C (482°F / 572°F) | 250°C / 300°C (482°F / 572°F) | 250°C / 300°C (482°F / 572°F) | 250°C / 300°C (482°F / 572°F) | 250°C / 300°C (482°F / 572°F) | 385°C (725°F) |
| Heating/Cooling Medium | Thermal Oil | Thermal Oil | Thermal Oil | Thermal Oil | Thermal Oil | Thermal Oil | Thermal Oil |
| Customized Configuration | Fully Supported / ✓ | Fully Supported / ✓ | Fully Supported / ✓ | Fully Supported / ✓ | Fully Supported / ✓ | Fully Supported / ✓ | Fully Supported / ✓ |
Features
1.Multi-segment computerized temperature & pressure program control ensures flawless resin flow and uniform cure curves for high-layer count PCBs (up to 30+ layers), eliminating delamination and warpage.
2.Central Single-Main Oil Cylinder guarantees perfectly balanced pressure distribution. Prismatic V-shaped guide rails maintain parallel alignment under high pressure (tolerance within 0.05mm per DIN-ISO 1101).
3.With vacuum levels reaching < 10 mbar (< 7.5 mm Hg), volatile gases and moisture are removed rapidly, preventing micro-voids in high-density IC substrates and rigid-flex boards.
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