Views: 0 Author: Site Editor Publish Time: 2026-10-16 Origin: Site
In modern multilayer PCB fabrication and SMT production lines, copper foil thickness consistency is critical to electrical performance and current-carrying reliability. The Automatic PCB Copper Thickness Inspection Machine provides a high-efficiency, in-line testing solution specifically designed for precise copper thickness measurement after electroplating and surface finishing.
Equipped with three pairs of high-sensitivity tungsten steel probes (MT01), this automated copper thickness tester performs high-speed double-sided simultaneous measurement (3, 6, or 9 test points per board) with an accuracy of ±3% across a measurement range of 0.2 to 250 μm.
With advanced optical recognition and drill-data integration, the system automatically identifies board layouts, locates optimal test positions, and intelligently avoids drilled holes and vias. Integrated pneumatic clapping mechanisms deliver precise central positioning for circuit boards ranging from 300×300 mm to 720×720 mm (thickness: 0.1–6.0 mm).
Engineered for seamless horizontal conveyor integration, the equipment achieves a testing throughput of 4 to 5 panels per minute:
Automated Workflow: Boards enter the line, undergo CCD barcode scanning, automatic alignment, dual-sided dot testing, and automated exit sorting.
MES & Quality Traceability: Integrated barcode scanners map batch, LOT number, and shift data directly to factory MES systems, ensuring 100% data traceability and compliance with IPC quality standards.
Smart Operation: Features intuitive touchscreen controls, real-time statistical SPC analysis, and automated alarm systems to safeguard continuous production.
Whether for rigid circuit boards, CCL (Copper Clad Laminates), or high-density multilayer PCBs, this in-line automatic copper thickness gauge streamlines inspection workflows, eliminates manual errors, and guarantees superior electroplated copper uniformity for global electronics manufacturers.
